Frost & Sullivan Manufacturing

DECEMBER 19, 2022

The “Apple” car intended to mark the tech giant’s big, splashy entry into the automotive industry will now debut only in 2026, with initial plans to equip it with fully autonomous driving capabilities abandoned for a simpler self-driving system. Our Perspective.

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Automotive Value chain Electronics Manufacturing 52

Frost & Sullivan Manufacturing

JANUARY 20, 2025

Running until January 22nd, the second edition of this expo underscores sustainability and innovation within the mobility ecosystem, reflected in its theme, “Beyond Boundaries: Co-creating Future Automotive Value Chain.” lakh generated substantial excitement.

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Automotive Cargo Value chain Compliance 52

Frost & Sullivan Manufacturing

FEBRUARY 5, 2024

Highlights of flagship automotive aftermarket trade event include more than 500 exhibitors, 1000 brands,1500 product categories, and strong domestic, regional, and international representation amidst focus on mobility ecosystem development and growth acceleration. lakh registered visitors. Roger Motors Pvt Ltd., and many, many more.

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Automotive Manufacturing Sourcing Value chain 59

Frost & Sullivan Manufacturing

JUNE 10, 2022

After a subdued, pandemic-affected 2020, the global automotive aftermarket bounced back in 2021. From 2022 to 2026, Frost & Sullivan projects a CAGR of 6.1% Digitization initiatives are being incorporated across the value chain, from ordering parts to delivery and service fulfillment. over 2021-2022.

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Automotive Value chain Supply Chain Form 52

i4.0 today

DECEMBER 5, 2024

It perfectly aligns with Ampere’s strategy to master the entire value chain of power electronics for its e-powertrain, leveraging STMicroelectronics’ expertise in power modules,” said Philippe Brunet, SVP Powertrain & EV engineering, Ampere. “ST

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Supply Chain Electronics Value chain Manufacturing 52

Frost & Sullivan Manufacturing

DECEMBER 19, 2023

Prototypes are in the development stage, with mass production likely from 2026 onwards. Overall, over 9,000 patents have been registered across all levels of the value chain (electrolyte, electrode, cell, pack, and systems). At present, China is the leader in the SSB patent space.

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Value chain Prototype  Manufacturing Automotive 52

i4.0 today

FEBRUARY 12, 2025

The biggest driver of the development of PIC transceivers is AI, as higher-performance AI accelerators will require higher-performance transceivers, with 3.2Tbps transceivers expected to arrive by 2026. What are the future applications? A breakdown of Co-Packaged Optics and its key concepts.

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